半导体行业英文资讯

Researchers have developed two new organic semiconductor materials using a light-driven chemical reaction. The paper is published in Chemistry—A European Journal.

New York’s 27-year-old semiconductor outreach consortium unveiled its new name at SEMICON West, swapping “nanotech” for a pitch built around the state’s growing chip ecosystem. The post NY Loves Nanotech Rebrands as Semiconductor Alliance NY appeared first on Semiconductor Digest .

Wavefront phase imaging captures 16 million data points in a single shot, aiming at in-line shape and stress measurement on every wafer The post Wooptix Brings Astronomy Optics to Wafer Metrology appeared first on Semiconductor Digest .

Inline, Lego-like deposition platforms honed in glass and solar target through-glass vias and an eventual shift to optical interposers The post VON ARDENNE Scales HiPIMS Sputtering from Wafers to Panels appeared first on Semiconductor Digest .

DUNE corrects wafer bow one wafer at a time, NLX brings X-ray inline, and mask tools get ready for High-NA's larger reticles The post ZEISS SMT Expands from Lithography Optics into Advanced Packaging Process Control appeared first on Semiconductor Digest .

With WGNSTAR now part of ABM, the company says it can staff a fab from construction cleaning to decommissioning as U.S. projects multiply The post ABM Maps the Six Phases of a Fab’s Life appeared first on Semiconductor Digest .

New ETEL METIS HP air bearing stage uses multi-degree-of-freedom encoders to target maskless lithography and inspection on large panels The post HEIDENHAIN Brings Front-End Motion Control Precision to Advanced Packaging appeared first on Semiconductor Digest .

V93000 integration with FormFactor's TRITON prober and a new turnkey optical test rack target the move from engineering to HVM The post Advantest Readies Silicon Photonics Test for Volume Production appeared first on Semiconductor Digest .

From engineering plastics in semiconductor wafer equipment to EUV dry resist precursors, MCG says its vertically integrated portfolio touches nearly every step of chipmaking The post Mitsubishi Chemical Group: The Materials Supplier Hiding Inside the Tool appeared first on Semiconductor Digest .

View or Download the SEMICON West Show Daily — Day Three! The post Show Daily 2026 — Day Three appeared first on Semiconductor Digest .

Advanced packaging has a bigger place at SEMICON West than ever, with three days of packaging content on this year’s program, and SEMI is building a global home for the topic through its Advanced Packaging and Heterogeneous Integration (APHI) technology coalition. The post SEMI Builds a Global Home for Advanced Packaging appeared first on Semiconductor Digest .

When SEMI asks member companies what could hold back their growth, the number one answer is talent, Joe Stockunas, president of SEMI Americas, said at Monday’s SEMICON West press conference. The post SEMI Scales Up Workforce Programs as U.S. Talent Gap Nears 200,000 appeared first on Semiconductor Digest .

ChipAgents, the agentic AI platform for semiconductor engineering, today introduced Build-A-Chip-Bench, a benchmark built in collaboration with NVIDIA designed to test whether AI agents can carry an end-to-end digital chip-design task from specification through physical implementation and verified GDS; thus, measuring true progress toward semiconductor design superintelligence. The post ChipAgents, NVIDIA Launch Benchmark for Autonomous Chip Design appeared first on Semiconductor Digest .

Nordson Test & Inspection, a global leader in inspection, metrology, and testing solutions, will showcase its comprehensive portfolio of industry-leading optical, X-ray, acoustic inspection, and metrology technologies powered by the Nordson Intelligence Ecosystem at SEMICON West 2026, October 13–15, in Booth 5844 at the Moscone Center in San Francisco, California. The post Nordson Debuts SonoFlex Acoustic Inspection System at SEMICON West appeared first on Semiconductor Digest .

Siemens today announced significant advances in its collaboration with NVIDIA to accelerate computational lithography workflows. The post Siemens, NVIDIA Accelerate Computational Lithography Up to 12× appeared first on Semiconductor Digest .

Nexus and Oscar are Eliyan’s first NuLight chiplet products that enable optical connectivity designed for the high-bandwidth, extended reach, and low-power requirements of large AI scale-up and future scale-in systems at copper economics. The post Eliyan Introduces NuLight Optical Interconnect Chiplets appeared first on Semiconductor Digest .

Solid-oxide fuel cells (SOFCs), which convert chemical energy directly into electrical power, are promising energy-conversion technologies because they can operate on various fuels, including hydrogen, natural gas and biogas.

NVIDIA today announced semiconductor leaders are adopting NVIDIA CUDA-X libraries — including the new NVIDIA cuPotential library, which developers can use to build AI agents that simulate how atoms and molecules interact — to advance AI-defined fabs. The post NVIDIA Launches Semiconductor Simulation Tools for AI-Defined Fabs appeared first on Semiconductor Digest .

Collaboration aims to accelerate development of the manufacturing and design capabilities needed for future nanostack generations. The post IBM and Siemens Collaborate on Next-Generation Nanostack Transistors appeared first on Semiconductor Digest .

President Trump's agreement with Japan unlocks up to $21 billion investment to expand foundational semiconductor production, support American jobs and strengthen domestic supply chains. The post GlobalFoundries to Operate Two New Fabs Under $21B U.S.–Japan Initiative appeared first on Semiconductor Digest .

View or Download the SEMICON West Show Daily — Day Two! The post Show Daily 2026 — Day Two appeared first on Semiconductor Digest .

As manufacturers face growing uncertainty tied to critical material shortages and global supply chain disruptions, the Department of Energy's (DOE) Oak Ridge National Laboratory (ORNL) researchers have developed a super intelligence (SI)-driven platform to help companies evaluate electric motor technologies before market conditions shift.

Ahead of his presentation at SEMICON West, Chris Jones, Environmental Sustainability Manager at Edwards, argues that framing misses most of what actually drives a fab’s environmental performance. The post Semiconductor Sustainability Needs a Whole-Fab View, Not a Point-of-Use Fix appeared first on Semiconductor Digest .

SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, today announced Kulicke & Soffa as the recipient of the 2026 SEMI Award for North America. The post Kulicke & Soffa Earns 2026 SEMI Award for North America at SEMICON West appeared first on Semiconductor Digest .

ETEL, the supplier of high-performance motion control components and complete motion platforms, is proud to introduce the METIS HP, a new full air bearing planar platform designed for the most demanding step‑and‑scan semiconductor applications, including direct laser writing and high‑resolution optical inspection systems. The post ETEL Launches METIS HP High-Precision Motion Platform appeared first on Semiconductor Digest .

New production capabilities at the Mesa, Arizona, facility will support growing demand for copper interconnects and advanced packaging applications. The post Fujifilm to Expand CMP Slurry Production Capacity in the U.S. appeared first on Semiconductor Digest .

Global 300mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI reported today in its latest 300mm Fab Outlook. The post Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates appeared first on Semiconductor Digest .

Advanced Energy Industries Inc. today launched the new Centra Smart Hub at SEMICON West in San Francisco. The post Advanced Energy Launches Temperature Measurement System for Semiconductor Processing appeared first on Semiconductor Digest .

Multi-year agreement expands dedicated capacity across Tower's global fab network to support the companies’ growth in optical and copper interconnects for next-generation AI infrastructure. The post Tower Semiconductor and Semtech Expand SiGe Manufacturing Partnership for AI Data Centers appeared first on Semiconductor Digest .

From blinking and smiling to jaw clenching and eyebrow raising, faces are constantly in motion—and generating tiny amounts of energy along the way. Now, Northwestern University engineers are putting that energy to work.

Nikon Corporation will release the DSP-110 digital lithography system for semiconductor advanced packaging in April 2027. The post Nikon Unveils Digital Lithography System for Advanced Semiconductor Packaging appeared first on Semiconductor Digest .

Researchers based in China and Malaysia report conventional nano-scale amber light-emitting diodes (LEDs) based on indium gallium nitride (InGaN) with 10% peak external quantum efficiency (EQE)...

Two-dimensional (2D) semiconductors, only a few atomic layers thick, are promising materials for making AI chips faster and more energy efficient by stacking additional semiconductor layers on top of existing computing circuits. However, when crystals form at multiple random locations during growth, it is difficult to produce high-quality semiconductors at the desired positions.