Power ElectronicsSemiconductor Digest
Infineon Processes Functional Power Devices on 300mm SiC Wafers
Publisher: Semiconductor DigestPublished: November 10, 2026 at 01:04 AM
Article Summary
Infineon Technologies AG has successfully processed 300mm silicon carbide wafers into functional power devices at its fab in Villach, Austria. The post Infineon Processes Functional Power Devices on 300mm SiC Wafers appeared first on Semiconductor Digest .
Power ElectronicsManufacturingSemiconductors
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